Fluid Dispensing Applications for Data Center Hardware Assembly

Beyond Semiconductor Packaging

Precision dispensing is used throughout electronic assembly processes supporting data center infrastructure.

GPD Global’s technologies support numerous applications including:

Conductive Adhesive Dispensing

Conductive adhesives provide both mechanical attachment and electrical connectivity.

Precision Electrical Interconnections

Conductive adhesives provide:

  • Mechanical bonding
  • Electrical conductivity

Used extensively in:

  • Networking hardware
  • Storage systems
  • Power electronics
Example

Network switches used within hyperscale data centers contain complex electronic assemblies requiring reliable electrical interconnections.

Precision dispensing enables accurate placement of conductive materials while minimizing waste and variation.

Encapsulation and Protection

Environmental protection is essential for long-term product reliability.

Dispensed encapsulation materials help protect components from:

  • Moisture
  • Contaminants
  • Mechanical shock
  • Environmental stress

GPD Global supports multiple encapsulation applications, including glob-top and potting processes.

Recommended GPD Global Solutions

High Precision Dispensers

Enable accurate placement of conductive materials with repeatable results.

Benchtop Dispensing Systems

Ideal for:

  • Process development
  • R&D
  • New product introduction

Schedule a Conductive Adhesive Dispensing Evaluation

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