Solder Paste Dispensing for Aerospace and Defense

Case Study

A global aerospace and defense leader requested a capability test of small volume solder paste dispensing on FR4 circuit boards.

Recommended Dispensing Process:

A precision dispensing system, MAX Series was utilized for this testing. The MAX automated dispense system was equipped with standard features including automatic vision alignment, contact surface sensor (laser is an alternative), automatic nozzle calibration and nozzle cleaning. The application specialist recommended the Precision Auger dispensing pump. The .062 diameter / 32Pitch auger along with 31G Precision needle (0.133mm ID) was chosen for this project.

Dispense Parameters:

The information table below displays the key process parameters utilized for capability testing.

PumpPrecision Auger
Auger.062 Diameter / 32Pitch auger
Needle31G Precision (0.133mm ID), 6mm long
Syringe Pressure10 psi
Dispense Height (Z)0.0762mm
Settle/Snap-off Z0.762mm
Dispense Velocity7.62mm/sec
Pump Speed10,000 cts/sec
Snap-off Velocity1 in/sec
Pump Reverse750 steps
Early Valve Off0.178mm
Pre Snap-off Delay0.050 sec

Conclusions: Solder Paste Dispensing for Aerospace and Defense

As shown in the example below, the results were consistent and achieved the desired cycle time.

Solder Paste Dispensing

Final Dispensing Equipment Recommendation:

Dispense SystemMAX Series System with auto vision, contact surface sensor, automatic nozzle calibration and automatic nozzle cleaning.
Dispense Pump:Precision Auger
Material:Indium 12.8HF T6 Solder Paste
Needle Size and Type:31G Precision Needle (0.133mm ID), 6mm long

GPD Global offers dispensing system customization and in-house application evaluations with our customers. Call 1.970.245.0408 or email

Read more about fluid dispensing applications.