A leading electronics manufacturer specializing in advanced semiconductor packaging encountered an issue with excessive dripping...
Improving the gap filler Tputty dispense process.
The primary goal was filling a rectangular cavity on a connector in less than 3 seconds with EpoTek H20E-FC snap curing epoxy.
Dispensing small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors
A test to dispense Techspray Wondermask 2204 solder mask for locations including large and small screw holes, through-hole vias
One of our customers in the medical industry requested dam and fill application testing on a Kapton® substrate.
A global aerospace and defense leader requested a capability test of small volume solder paste dispensing on FR4 circuit boards...
A smart lighting company wished to dispense silicone-based LED encapsulation material for two different product sizes...
The goal was to dispense a 1mm diameter dot with acceptable speed and consistency...
One of our defense customers planned to dispense underfill material for small and large die, using Hysol FP4545FC...
One of our aerospace customers was looking to automate a few manual operations and asked for suggestions...
A customer wanted to dispense a mask to protect gold leads and an underfill on a silicon substrate with a clear test die...
