A customer wanted to dispense a mask to protect gold leads and an underfill on a silicon substrate with a clear test die...
One of our aerospace customers was looking to automate a few manual operations and asked for suggestions...
One of our defense customers planned to dispense underfill material for small and large die, using Hysol FP4545FC...
The goal was to dispense a 1mm diameter dot with acceptable speed and consistency...
A smart lighting company wished to dispense silicone-based LED encapsulation material for two different product sizes...
A global aerospace and defense leader requested a capability test of small volume solder paste dispensing on FR4 circuit boards...
One of our customers in the medical industry requested dam and fill application testing on a Kapton substrate.
A test to dispense Techspray Wondermask 2204 solder mask for locations including large and small screw holes, through-hole vias
Dispensing small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors
The primary goal was filling a rectangular cavity on a connector in less than 3 seconds with EpoTek H20E-FC snap curing epoxy.
Improving the gap filler Tputty dispense process.
