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About
Company Profile
News & Events
Dispensing Case Studies
Employment
Legal Notices
Privacy Policy
Dispenser Systems Security Standard
Environmental Sustainability
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Case Studies
Masking and Underfill Dispensing for Medical Devices
Staking Epoxy Adhesive for Aerospace
Underfill Dispensing for Aerospace, Military and Defense
Thermal Interface Material (TIM) Dispensing for Consumer Products
LED Encapsulation for Consumer Products
Solder Paste Dispensing for Aerospace and Defense
Dam and Fill Dispensing for Medical
Solder Mask Dispensing for Electronics and Aerostructures
Small Volume Solder Paste Dispensing for Aerospace and Defense
Conductive Adhesive Dispensing for Electronic Manufacturing
Laird Tputty™ 607 Thermal Interface Material (TIM) Dispensing
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Conformal Coating
Selective Coating Machines – SimpleCoat
Selective Coating Machines – Tilt and Rotate
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Dispensing Equipment
High Precision Dispenser – MAX Series
Large Format Dispenser – DS Series
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Loader & Unloader
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Axial- Taped Or Loose
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Fluid Dispensing Applications
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APPLICATION OVERVIEW
Solder Paste
Conductive adhesive
Surface Mount Adhesive
Non-Conductive Adhesive
Thermal Interface Material
Dam & Fill / Glob Top
Trench Filling
Encapsulation
Underfill
UV Curing
LED Encapsulation
Wafer Processing
Solder Mask
OTHER APPLICATIONS – ask us
Glue Dispensing
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