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Fluid Dispensing Videos, Applications

Fluid Dispensing Videos

Applications Overview / Conductive Adhesive & Non-Conductive Adhesive / Dam & Fill / LED Encapsulation / Solder Mask / Solder Paste / Surface Mount Adhesive / Thermal Interface (TIM) / Trench Filling / Underfill / UV Curable / Wafer Processing / Other Applications

Applications Overview

applications overview video thumbnail — Applications Overview.

Conductive Adhesive & Non-Conductive Adhesive

dispensing Ablestik 84-1LMI with NCM5000 Jetting Pump — Conductive Adhesive Dispense of Ablestik 84-1LMI with NCM5000 Jetting Pump

Dispensing dots and X with Precision Auger Pump — Non-Conductive Adhesive Dispense of Dots and X with Precision Auger Pump.

Dispensing Silver Ink Dots with PCD Volumetric Pump — Conductive Adhesive Dispense of Silver Ink Dots with PCD Volumetric Pump

Dispensing Epotek H20DE-PFC-D with Precision Auger Pump

Snap Curing Epoxy Dispensing

Dam and Fill

dispensing dam and fill — Dispensing Dam and Fill with Precision Auger Pump.

dispensing multilevel dam — Dispensing Multilevel Dam with Volumetric PCD Pump.

LED Encapsulation

LED encapsulation over large area — LED Encapsulation Fluid Dispensing.

LED Encapsulation on Table Top Robot — Benchtop LED Encapsulation.

Solder Mask

solder mask with time pressure and real time control — Solder Mask dispensed with Time Pressure & Real Time Control.

Water Washable Solder Mask dispensed with NCM5000 Jetting Pump — Washable Solder Mask dispensed with Jetting Pump.

Solder Mask dispensed with Volumetric Pump — Solder Mask dispensed with Volumetric Pump.

Solder Paste

Solder Paste Dispensing - Dots and Lines — Solder Paste Dispensing – Dots and Lines.

Solder Paste Dispensing - MicroVolume — Solder Paste Dispensing – MicroVolume.

Solder Paste Dispensing - 180 µm Width Pattern — Solder Paste Dispensing – 180 µm Line Width Pattern.

solder pin-in-paste on large format platform — Dispensing Solder Pin-In-Paste with Precision Auger Pump on large format platform DS9000.

Surface Mount Adhesive

dispensing surface mount adhesive using Jetting NCM5000 Pump — Dispense Surface Mount Adhesive using Jetting NCM5000 Pump.

Thermal Interface Material (TIM)

thermal grease with volumetric pump — Thermal Grease with Volumetric Pump.

thermal adhesive lid attach process with precision auger pump — Thermal Adhesive and Grease (Lid Attach Process) with Precision Auger Pump.

Laird Tputty 607 Dispensing — Laird Tputty™ 607 Thermal Interface Material (TIM) Dispensing

Trench Filling

trench filling with Precision Auger Pump — Trench Filling with Precision Auger Pump and precision needle.

Underfill

underfill process on large components — Underfill process on large device with PCD Volumetric Pump.

underfill process with tight keep out area — Underfill process on 6 mm die with NCM5000 Jetting Pump.

UV Curable

large encapsulants, complex pattern, UV curable material, stack over device with volumetric PCD pump — Large encapsulants, complex pattern, thick UV curable material, stack over a device with Volumetric PCD Pump.

Process dispense and UV cure within same system — Dispensing and UV Curing within the same System.

Wafer Dispensing / Wafer Processing

adhesive dispensed on wafer (MEMS) image — Dispensing Adhesive Seal (MEMS) on Wafer with Precision Auger Pump.

edge seal dispensed on wafer image — Dispensing Edge Seal on Wafer with Volumetric PCD Pump.

Other Applications

table top robot demonstration with ChoBond/Chomerics 1075 — Table Top System demonstrates XYZ coordinated motions with Cho-Bond/Chomerics 1075.

dispense MulTempSC EF grease demonstration with PCD6 volumetric pump — Dispense Grease (MulTemp SC EF) with PCD6 Volumetric Pump.

pick and place LCD on PCB — Multifunctional System demonstrating both fluid dispensing and pick and place operations.

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