Solder paste dispensing is a method of applying solder paste to specific areas of a printed circuit board (PCB) or an electronic component to make electrical connections between them.
Our Solder Paste Dispensing machines and pumps are capable of precisely and consistently dispensing solder pastes of all types and formulations. Auger pump, fluid pressure control (FPC), time pressure, and Jetting Pump can be used for solder paste dispensing. Each method has its own advantages and disadvantages, depending on the requirements.
Application Information: Solder Paste Dispensing
