As AI processors become larger and more powerful, manufacturers face increasing challenges related to mechanical stress and thermal cycling.
Every time a server powers on and off, semiconductor packages expand and contract due to temperature changes. These repeated cycles can place stress on solder joints connecting silicon devices to substrates.
Underfill is a specialized material dispensed beneath semiconductor packages to strengthen solder interconnections and improve reliability.
Benefits include:
GPD Global provides solutions for underfill dispensing applications and advanced semiconductor packaging processes.
An AI accelerator may contain:
A consistent underfill process helps protect these connections and maintain package integrity throughout the product lifecycle.
GPD Global Dispensing System
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Underfill Process
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Advanced Semiconductor Package
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AI GPU/CPU
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Data Center Server
Precision underfill dispensing strengthens semiconductor packages used in high-performance computing and AI applications.
Designed to deliver highly repeatable underfill patterns for complex semiconductor packages.
Provide accurate control of:
Schedule an Underfill Dispensing Evaluation
