Solder Paste Dispense Systems

Solder Paste Dispense Systems: Solder Paste Dots, Lines, Complex Shapes, 01005, 0402

Solder Paste is used to make electrical connection between a PCB and component. A range of automated dispense systems, coupled with a selection of precision dispense pumps, provides a versatile method of applying solder. Unlike a screen printer that is fixed in pad placement and volume, a dispenser can easily alter dispense location and volume based on adjusted program parameters. Our line of fully automated fluid dispense systems and pumps are capable of dispensing any pattern including dots, lines, complex shapes, micro volumes for components such as 01005, and pin in paste.

examples of solder paste dispense
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Solder Paste Dispense Systems with Auger Pump

Solder Paste dispense accuracy is best accomplished with an auger pump. Precision Auger pump handles a wide range of dispense processes with a simple configuration change. The auger/cartridge assembly is available in three different diameters for micro dispensing, medium volumes and large volumes. It accommodates solder spheres without damage.

auger diameter by dispense volume of solder paste dispensed

A correctly selected nozzle manages pressure and ensures a consistent, accurate dispense process. Our standard Precision Dispense tips for Precision Auger pump improve wetting in sizes down to 100 µm. They are available in either steel or ceramic.

Solder Paste Dispense Equipment with Real Time Process Control

Couple our Precision Auger Pump with Real Time Process Control Systems (FPC) for improved dispensing results over full range of fluid level in syringe. Real Time Process Control ensures a constant fluid supply to the pump regardless of reservoir size or fluid level. FPC monitors fluid pressure entering dispense pump and makes adjustments to reservoir feed pressure, resulting in a consistent feed to pump.

Additionally, we offer a retrofit kit for retrofitting a Precision Auger Pump into your platform. Retrofit kits come complete with a controller and the necessary interface cables and mounting.

Solder Paste Dispense and Automated Fluid Dispense Systems

Our fully automated fluid dispense systems – MAX and DS Series – have features necessary for a successful dispense process such as fiducial alignment, surface sensing on multiple levels, and the ability to program complex patterns that may be recalled as needed. Compatibility with our full range of dispense pumps and the ability to use up to three pumps in a single process makes our systems exceptionally versatile.

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Solder Paste Dispense Recommendations