Pin-In-Paste Solder Paste Dispensing

Pin-in-Paste for Solder Reflow Technology

Solder Paste is used to make the electrical connection between a PCB and component. A range of automated dispense systems, coupled with a selection of precision dispense pumps, provides a versatile method of applying solder. Unlike a screen printer that is fixed in pad placement and volume, a dispenser can easily alter the dispense location and volume based on adjusted program parameters. Our line of automated dispense systems and pumps are capable of dispensing solder paste Pin-In-Paste and patterns like dots, lines, complex shapes, and micro volumes for components such as 01005.


Pin-In-Paste is a process used to solder through-hole components to a printed circuit board (PCB) using Solder Reflow Technology. For PCBs with both surface mount and through-hole components, the through-hole components are typically soldered after the Surface Mount components. The Pin-In-Paste process allows through-hole components not only to be soldered at the same time but it also allows use of the same process as surface mounted components. Pin-In-Paste results are best when dispensed with our Precision Auger Pump.

Paste may be dispensed before pin insertion (Image 1) or after components have been inserted (Image 2).

Pin-in-paste dispensed before pin insertion.
Image 1: Pin-In-Paste dispensed before pin insertion.
Dispense tip ready to dispense solder paste after pin insertion.
Image 2: Dispense tip ready to dispense solder paste after pin insertion has occurred.

Solder Pin-in-Paste with Auger Pump

The Precision Auger pump handles a wide range of dispense processes with a simple configuration change. The auger/cartridge assembly is available in three different diameters and accommodates solder spheres without damage.

auger diameter by pin-in-paste dispense volume

A correctly selected nozzle manages pressure and ensures a consistent and accurate dispense process. Our standard Precision Dispense tips for the Precision Auger pump improve wetting in sizes down to 100 µm and are available in either steel or ceramic.

Solder Pin-in-Paste with Real Time Process Control

Couple the Precision Auger Pump with Real Time Process Control System (FPC) for improved dispensing results over the full range of the fluid level in the syringe. Real Time Process Control ensures a constant supply of fluid to the pump regardless of reservoir size or fluid level. FPC monitors the pressure of fluid entering the dispense pump and makes adjustments to the reservoir feed pressure, resulting in a consistent feed to the pump.

Additionally, we offer a retrofit kit for retrofitting a Precision Auger Pump into your platform. Retrofit kits come complete with a controller and the necessary interface cables and mounting.

Solder Pin-in-Paste and Automated Fluid Dispense Systems

GPD Global’s fully automated fluid dispense systems – MAX and DS Series – have features necessary for a successful dispense process such as fiducial alignment, surface sensing on multiple levels, and the ability to program complex patterns that may be recalled as needed. Compatibility with our full range of dispense pumps and the ability to use up to three pumps in a single process makes our systems exceptionally versatile.

More solder paste dispensing information:

Solder Pin-in-Paste Recommendations