Staking: Epoxy Bonding & Support
Staking is a process where a structural epoxy is added to provide additional support or bonding strength between a device and the pcb surface. The primary purpose is to minimize the effects of vibration and reduce pressure on component leads. This process is done by dispensing adhesives or epoxies, which provide additional bond strength in high-stress environments.Staking is a common process in the aerospace and defense industries where rugged electronic assemblies are necessary. Staking is typically used with through-hole components or large SMT components. As such, several characteristics should be considered when selecting a staking material that may have an impact on the dispensing technology used to deposit it.
Viscosity:
In some cases, a low-viscosity adhesive is well suited, as it will flow under and around the leads of a component, resulting in a solid layer between the component body and the substrate surface. However, this does limit the rework options available for the component, and the adhesive may flow out beyond the desired area, adversely interfering with other nearby components. A higher viscosity material is often utilized to prevent adhesive material creep.
Single vs. Two Component Adhesive:
Many different adhesives are readily available in either single component or two component formulations, which require mixing before use. The two-part materials usually have a short working life and will begin curing very quickly. These materials require the use of specialized mixing pumps or can be dispensed using a Time Pressure System where all wetted parts are disposable.GPD Global’s Applications Department is available to discuss the details of your staking project and to recommend the optimal equipment configuration for your unique needs.
STAKING: Product Recommendations
