Potting is a specific type of encapsulation process that is most often used to protect electronic assemblies from moisture and provide electrical insulation. Potting for precision small volume encapsulation can also provide some level of protection for the assembly from physical or thermal shock, chemical damage, or prevent tampering and theft of intellectual property.
“Potting” and “encapsulation” are often used synonymously. However, the term “potting” specifically refers to a process where the shell of an assembly becomes a part of the final product. In “encapsulation”, the assembly with hardened epoxy is removed from the shell or mold to be used in a separate assembly. Potting materials may be selected from three major compound types – epoxies, silicones, and urethanes. Each has specific strengths and drawbacks. Most potting materials will have a low-viscosity formulation to flow around components and connectors. Please consult with your material supplier for assistance in selecting an appropriate material.
Potting Encapsulation: Production Recommendations