Package-on-Package (PoP) underfill is a critical process in advanced semiconductor packaging, where multiple integrated circuit (IC) packages are stacked vertically to create compact, high-performance assemblies. This 3D integration approach is widely used in mobile devices, wearables, and high-density computing applications where board space is at a premium.
In PoP configurations, underfill material is dispensed between stacked packages—typically between a logic die and a memory die—to enhance mechanical stability, thermal performance, and long-term reliability. The process must be executed with extreme precision to avoid overflow, voids, or damage to delicate interconnects.
| Challenge | Solution |
| Narrow Gaps Between Packages | High-precision needle or jet dispensing systems ensure accurate material placement in tight spaces. |
| Void Formation | Controlled dispense paths and vacuum-assisted fill techniques eliminate air entrapment. |
| Material Compatibility | GPD Global systems support a wide range of underfill chemistries, including low-viscosity and fast-curing formulations. |
| Thermal Sensitivity | Low-temperature dispensing processes protect heat-sensitive components during assembly. |
GPD Global offers advanced dispensing platforms specifically designed to meet the demands of PoP underfill applications. Our systems feature:
Applications
