The Defense Industrial Base consists of research and manufacturing to meet the needs of the U.S. military. Flexible and precise fluid dispensing systems are required to assist with development, process advancement and improvement for a variety of integral subsystems and components. Handling a wide range of fluids with applications for component underfill, component staking, TIMs for heat dissipation, solder-paste and conductive epoxies require reliable pump/valve selection and superior applications support.
We have a long history of providing precise fluid dispense systems for the defense industry in support of the U.S. Military since 1995. Our superior applications support helps defense contractors overcome difficult applications to dispense fluids which need to be done right the first time for mission critical applications. Our goal is to always deliver quality, technologically advanced products with highly dependable after-sale support.
View more information about specific applications such as potting, component underfill, module encapsulation, staking, micro-dispensing, micro-volume solder-paste dispensing, component staking, COB (wire bonded device) encapsulation, TIMs for heat dissipation, solder-paste, and conductive epoxies
