As the lines blur between OSATS (Outsourced Semiconductor Assembly and Test) and EMS (Electronic Manufacturing Services) providers there has been a significant increase in demand from all end-user industries, particularly consumer electronics. With the demand for smartphones, devices gaming, data centers, and Internet of Things (IoT) the demand for value-added dispensing systems for product reliability, speed, and traceability has grown dramatically. Dispense systems with a selection of pumps/valves capable of operating in tandem configuration with a high degree of accuracy are critical for micro-volume solder-paste dispensing and COB (wire bonded device) encapsulation.
We have a long history of providing precision fluid dispensers for the consumer products / EMS industries industry since 1995. Our superior applications support helps electronic contract manufacturers choose the right equipment that is flexible and precise. For high volume applications such as smart phone assembly we have inline dispensers and pumps/valves capable of operating in tandem configuration with a high degree of accuracy.
View more information about specific applications such as potting, component underfill, module encapsulation, staking, micro-dispensing, micro-volume solder-paste dispensing, component staking, COB (wire bonded device) encapsulation, TIMs for heat dissipation, solder-paste, and conductive epoxies