Chip-on-Wafer (CoW) underfill is a vital process in microelectronic packaging, particularly for high-density interconnects such as Ball Grid Array (BGA) and Chip Scale Packaging (CSP). As devices become smaller and more powerful, the need for robust mechanical and thermal support becomes increasingly critical.
Underfill material is dispensed between the chip and wafer substrate to:
This process is essential for maintaining the structural integrity of the device throughout its lifecycle, especially in high-performance and mobile applications.
GPD Global’s precision dispensing platforms are engineered to meet the evolving demands of CoW underfill applications. Our systems offer:
| Challenge | Solution |
| Tight Keep-Out Zones | High-precision jetting systems with ±40 μm or better placement accuracy prevent material overflow into sensitive areas. |
| Material Flow Control | Multi-dot dispense strategies and calibrated process jetting (CPJ) ensure uniform fill and prevent bridging. |
| Wafer Warpage | Maximum Z Height Sensing dynamically adjusts dispense height to avoid nozzle crashes and ensure consistent coverage. |
| High Throughput Needs | Jetting systems cycling at up to 300Hz minimize process cycle time on densely populated wafers. |
With decades of experience in precision fluid dispensing, GPD Global delivers solutions that meet the evolving demands of semiconductor packaging. Our CoW underfill systems are engineered for:
By addressing the challenges of CoW underfill with innovative technology and process expertise, GPD Global empowers manufacturers to achieve greater reliability, performance, and efficiency in their packaging workflows.
