The automotive industry need for electronics is rapidly changing and expanding with the implementation of advanced safety systems for lane departure, parking assistance, automatic emergency breaking, automatic emergency calling, energy storage and infotainment. The total cost of electronics in vehicles is approximately 35% and will grow to 50%. Fluid dispensing systems with flexible pump/valve products provide reliable solutions for potting, component underfill, module encapsulation and micro-dispensing for MEMS sensors.
We have a long history of providing companies involved with automotive manufacturing precision fluid dispensing machines since 1995. Our superior applications support helps automotive manufacturers choose the right equipment that is flexible and precise. For high volume automotive applications, we have inline dispensers and pumps/valves capable of operating in tandem configuration with a high degree of accuracy.
View more information about specific applications such as potting, component underfill, module encapsulation, staking, micro-dispensing, micro-volume solder-paste dispensing, component staking, COB (wire bonded device) encapsulation, TIMs for heat dissipation, solder-paste, and conductive epoxies
