BGA Underfill

What Is BGA Underfill?

BGA underfill is an adhesive material applied beneath the BGA chip to bond it securely to the printed circuit board (PCB). It flows under the chip during assembly and cures to form a strong bond. Underfill compensates for the coefficient of thermal expansion (CTE) mismatch between the BGA and the PCB, reducing the risk of solder joint failure.

Ball Grid Array (BGA) devices are widely used in modern electronics assemblies due to their compact size and high pin count. However, their reliability can be affected by factors such as thermal cycling, mechanical stress, and solder joint fatigue. BGA underfill is an effective solution to enhance the mechanical or thermo-mechanical reliability of these assemblies.

• Improved Reliability: Underfill minimizes stress on solder joints during temperature cycling, preventing cracks and fatigue failures.
• Enhanced Thermal Performance: Underfill improves heat dissipation by providing a continuous thermal path between the BGA and the PCB.
• Increased Vibration Resistance: Underfill helps absorb mechanical vibrations, reducing the risk of solder joint fractures.
• Ruggedization: Underfill can be used to enhance the reliability of other components, such as TSOP and CSP packages.

• CTE Match: Select an underfill with a CTE similar to that of the BGA and PCB materials to minimize stress during temperature changes.

• Application Method: Dispensing underfill manually or using automated equipment affects the choice of material.

• Loading Conditions: Full-area underfill, perimeter bonding, or edge bonding offer different levels of mitigation based on the loading conditions

BGA underfill significantly enhances the reliability of electronic assemblies. By carefully selecting the right underfill material and application method, manufacturers can improve the longevity and performance of BGA-based products.

GPD Global’s BGA underfill process is a vital method that guarantees strong connections and long-lasting performance in contemporary electronic devices.