Micro Volume Dispensing
Minimizes Setup between PCB Runs & Reduces Material Costs
| Micro Volume Dispensing |
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| Technical Article (pdf) |
| Related Articles: > Micro Dispensing > Flip Chip Assemblies |
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The continuing trend toward miniaturization in consumer electronics, from cell phones to hand-held computers to stereo systems, has resulted in increasingly smaller SMT components and more densely assembled PCBs.
Efficient handling of these small, crowded packages and substrates during assembly requires a precise method for depositing extremely small volumes of material (e.g., solder pastes, conductive epoxies, and adhesives) to adhere components and complete electrical connections without creating shorts or bridges. This has become a necessity for DCA (direct chip attach), multi-chip module, and high-density interconnect processes, most of which require placement accuracy of 0.0015" (0,0381mm) or better. In the case of solder paste and conductive epoxy, dot sizes are 0.010" (0,254mm) or smaller. For area fills and patterns, thicknesses of 0.0020" (0,0508mm) or less are required. These needs have resulted in the development of new technologies specifically designed to facilitate small-volume dispensing. ...more (pdf)