Fine Pitch Micro-Dispensing
| Fine Pitch Dispensing |
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| Technical Article (pdf) |
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Micro-dispensing handles small-dot solder deposition when stencil printing can not
As the technology for small electronic products evolves, the printed circuit boards in these products become more densely populated, and with ever smaller components. While designers struggle to squeeze more components onto shrinking amounts of real estate, assemblers face the daunting task of depositing precise, tiny dots of solder paste. Measuring 10 mils or less in diameter, solder paste dots must attach components and complete electrical connections without creating shorts or bridges.
Stencil printing is the fastest way to deposit large volumes of solder paste, but when PCBs are densely packed, this approach becomes less practical. For the toughest applications, manufacturers turn to “micro-dispensing” equipment. ...more (pdf)