Back-end Packaging
Evolving beyond Traditional Dispensing
Multi-functional Dispensing for Semiconductor Back-end Packaging
| Back-end Packaging |
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| Technical Article (pdf) |
| Recommended systems |
With semiconductor components and packages continuing to shrink in size, dot diameters of 10 mils and under mandate an "Integrated Engineering" approach to the design of dispensing equipment.
Fluid dispensers have long played an essential role in printed circuit board (PCB) assembly. In meeting the weight, size and performance requirements of devices such as cell phones, pagers and handheld computers, for instance, designers continue to be faced with the challenge of packaging higher densities of components on available real estate ... more (pdf)
GPD Global's dispense systems have been designed with accuracy in mind. The DS Series achieves an accuracy of ±0.0015" (0,038 mm) while the MAX Series exhibits outstanding accuracy of ±0.001"(0,025 mm). GPD's excellent positioning ability coupled with the unmatched Micro-Dot valve put the MAX Series and DS Series systems at the top of the list for accuracy, repeatability, and total functionality.