Fluid Dispensing Videos

Applications Overview / Conductive & Non-Conductive Adhesives / Dam & Fill / Hot Melt / LED Encapsulation / Solder Mask / Surface Mount Adhesive / Thermal Interface (TIM) / Trench Filling / Underfill / UV Curable / Wafer Processing / Other Applications

Applications Overview

Applications Overview.

Conductive & Non-Conductive Adhesive

dispensing Ablestik 84-1LMI with NCM5000 Jetting Pump
Conductive Adhesive Dispense of Ablestik 84-1LMI with NCM5000 Jetting Pump.
Dispensing dots and X with Precision Auger Pump
Non-Conductive Adhesive Dispense of Dots and X with Precision Auger Pump.
Dispensing Silver Ink Dots with PCD Volumetric Pump
Conductive Adhesive Dispense of Silver Ink Dots with PCD Volumetric Pump.
Dispensing Epotek H20DE-PFC-D with Precision Auger Pump
Dispensing Epotek H20DE-PFC-D with Precision Auger Pump

Dam and Fill

dispensing dam and fill
Dispensing Dam and Fill with Precision Auger Pump.
dispensing multilevel dam
Dispensing Multilevel Dam with Volumetric PCD Pump.

Hot Melt

hot melt
Hot melt dispensing down to 120 µm line width.

LED Encapsulation

LED encapsulation over large area
LED Encapsulation Fluid Dispensing.
LED Encapsulation on Table Top Robot
Bench Top LED Encapsulation.

Solder Mask

solder mask with time pressure and real time control
Solder Mask dispensed with Time Pressure & Real Time Control.
Water Washable Solder Mask dispensed with NCM5000 Jetting Pump
Washable Solder Mask dispensed with Jetting Pump - video.
Solder Mask dispensed with Volumetric Pump
Solder Mask dispensed with Volumetric Pump.

Solder Paste

Solder Paste Dispensing - Dots and Lines
Solder Paste Dispensing - Dots and Lines.
Solder Paste Dispensing - MicroVolume
Solder Paste Dispensing - MicroVolume.
Solder Paste Dispensing - 180 µm Width Pattern
Solder Paste Dispensing - 180 µm Line Width Pattern.
solder pin-in-paste on large format platform
Dispensing Solder Pin-In-Paste with Precision Auger Pump on large format platform DS9000.

Surface Mount Adhesive

Dispense Surface Mount Adhesive using Jetting NCM5000 Pump.

Thermal Interface Material (TIM)

thermal grease with volumetric pump
Thermal Grease with Volumetric Pump.
thermal adhesive lid attach process with precision auger pump
Thermal Adhesive and Grease (Lid Attach Process) with Precision Auger Pump.

Trench Filling

trench filling with Precision Auger Pump
Trench Filling with Precision Auger Pump and precision needle.

Underfill

underfill process on large components
Underfill process on large device with PCD Volumetric Pump.
underfill process with tight keep out area
Underfill process on 6 mm die with NCM5000 Jetting Pump.

UV Curable

Large encapsulants, complex pattern, thick UV curable material, stack over a device with Volumetric PCD Pump.
Process dispense and UV cure within same system
Dispensing and UV Curing within the same System.

Wafer Processing

adhesive dispensed on wafer (MEMS) image
Dispensing Adhesive Seal (MEMS) on Wafer with Precision Auger Pump.
edge seal dispensed on wafer image
Dispensing Edge Seal on Wafer with Volumetric PCD Pump.

Other Applications

Table Top System demonstrates XYZ coordinated motions with Cho-Bond/Chomerics 1075.
Dispense Grease (MulTemp SC EF) with PCD6 Volumetric Pump.
pick and place LCD on PCB
Multifunctional System demonstrating both fluid dispensing and pick and place operations.